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M95256-R 数据表(PDF) 40 Page - STMicroelectronics |
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M95256-R 数据表(HTML) 40 Page - STMicroelectronics |
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40 / 51 page ![]() 10.4 WLCSP8 (CS) package information This WLCSP is a 8-bump, 1.289 x 1.376 mm, 0.4 mm pitch wafer level chip scale package. Figure 29. WLCSP8 - Outline (4X) aaa Wafer back side D E Side view Detail A A2 A e1 e2 e G F Bump side H e3 bbb Z X Y Reference Orientation Detail A Rotated 90 ° A1 Bump Seating plane Z eee Z Z Z X ccc M Y Ø Ø ddd M b 1. Drawing is not to scale 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 3. Bump position designation per JESD 95-1, SPP-010. M95256-W M95256-R M95256-DF WLCSP8 (CS) package information DS4712 - Rev 22 page 40/51 |
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