M95640-R datasheet(52/53 Pages) STMICROELECTRONICS

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Revision history

M95640-W M95640-R M95640-DF

52/53

DocID16877 Rev 19

01-Feb-2013

Replaced ball by bump in the whole document.

Updated Section 7.2: Initial delivery state.

Added description of thin WLCSP 8 bump package including land pattern.

Updated Note 2.

13-May-2015

Updated Features and WLCSP package figure on cover page.

Updated Figure 3: 8-bump thin WLCSP connections (top view).

Removed note on UV exposure in Section 1: Description.

Updated Section 5.1.3: Power-up conditions.

Updated tables in Section 6: Instructions.

Updated Table 7: Absolute maximum ratings and its footnotes.

Updated Section 10: Package information with changes in each of

Sections 10.1: SO8N package information, 10.2: TSSOP8 package

information, 10.3: UFDFN8 package information and 10.4: Thin WLCSP

package information.

Updated Table 25: Ordering information scheme and added Note: on

Engineering samples.

11-Feb-2016

Updated Figure 4: Block diagram and Figure 9: Write Disable (WRDI)

sequence.

Updated caption of Figure 25 and Table 22 in Section 10.2: TSSOP8

package information.

Updated Table 24: Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level

chip scale package mechanical data.

Table 26. Document revision history (continued)

Date

Revision

Changes

M95640-R 数据表(PDF) 52 Page - STMicroelectronics