STM8AFSLASHP6346 datasheet(89/95 Pages) STMICROELECTRONICS

89 / 95 page

DS12343 Rev 2

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STM8AF6366

Package information

11.4.1

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

11.4.2

Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the order code (see

Section 12: Ordering information

The following example shows how to calculate the temperature range needed for a given

application.

Assuming the following application conditions:

Maximum ambient temperature TAmax= 82 °C (measured according to JESD51-2),

IDDmax = 14 mA, VDD = 5 V, maximum 20 I/Os used at the same time in output at low

level with IOL = 8 mA, VOL= 0.4 V

PINTmax = 14 mA x 5 V= 70 mW

PIOmax = 20 x 8 mA x 0.4 V = 64 mW

This gives: PINTmax = 70 mW and PIOmax 64 mW:

PDmax = 70 mW + 64 mW

Thus: PDmax = 134 mW.

Using the values obtained in Table 49: Thermal characteristics TJmax is calculated as

follows:

For LQFP64 46 °C/W

TJmax = 82 °C + (46 °C/W x 134 mW) = 82 °C + 6 °C = 88 °C

This is within the range of the suffix C version parts (-40 < TJ < 125 °C).

Parts must be ordered at least with the temperature range suffix C.

Table 49. Thermal characteristics(1)

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

LQFP 48 - 7 x 7 mm

°C/W

ΘJA

Thermal resistance junction-ambient

LQFP 32 - 7 x 7 mm

°C/W

ΘJA

Thermal resistance junction-ambient

VFQFPN32

°C/W

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