2

Electrical data

2.1

Absolute maximum ratings

Stressing the device above the rating listed in Table 2 may cause permanent damage to the device. These

are stress ratings only and operation of the device at these or any other conditions above those indicated in

the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability.

Table 2. Absolute maximum ratings

Symbol

Pin

Parameter

Value

Unit

Min.

Max.

VDRAIN

15, 16

Drain Blocking DC voltage

650

V

Drain transient voltage (Tpulse < 1 µs)

850

5, 10

Analog Inputs & Outputs

-0.3

3.6

V

IZCD

11

Zero Current Detector current

-3

3

mA

ITB

9

TB current

-3

3

mA

VDD

12

Supply Voltage (IDD < 25 mA)

-0.3

Self-

limited

V

IDD

12

Device supply current + internal Zener capability

25

mA

VDRV

13

Driver supply maximum voltage

12

V

ViOVP

6

iOVP configuration according to Figure 28, Figure 29 or

Figure 30

10

V

iOVP externally biased

6

V

VHV

8

Start-up pin (IHV<100 uA)

-0.3

Self-

limited

TJ

Junction Temperature Range

-40

150

°C

TSTG

Storage Temperature

-55

150

°C

2.2

Thermal data

Table 3. Thermal data

Symbol

Parameter

Max. value

Unit

RTH-JEP

Thermal resistance junction to Exposed Pad (1)

1.5

°C/W

RTH-JA

Thermal resistance junction to ambient (1)

32

°C/W

1. Pdiss = 1 W – Natural Convection - Board: 11.4 mm x 7.6 mm FR4, 4 layer, 2 oz copper, 5 vias under EP JESD 51-7

VIPERGAN50

Electrical data

DS13888 - Rev 2

page 4/37