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BAS86 数据表(PDF) 2 Page - NXP Semiconductors |
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BAS86 数据表(HTML) 2 Page - NXP Semiconductors |
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2 / 6 page ![]() 1996 Oct 01 2 Philips Semiconductors Product specification Schottky barrier diode BAS86 FEATURES • Low forward voltage • High breakdown voltage • Guard ring protected • Hermetically-sealed small SMD package. APPLICATIONS • Ultra high-speed switching • Voltage clamping • Protection circuits • Blocking diodes. DESCRIPTION Planar Schottky barrier diode with an integrated protection ring against static discharges. This surface mounted diode is encapsulated in a hermetically sealed SOD80C glass SMD package with tin-plated metal discs at each end. It is suitable for “automatic placement” and as such it can withstand immersion soldering. Fig.1 Simplified outline (SOD80C), pin configuration and symbol. handbook, halfpage MAM190 ka Cathode indicated by a grey band. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage − 50 V IF continuous forward current − 200 mA IF(AV) average forward current see Fig.2 − 200 mA IFRM repetitive peak forward current tp ≤ 1 sec.; δ≤ 0.5 − 500 mA IFSM non-repetitive peak forward current tp =10ms 5 A Tstg storage temperature −65 +150 °C Tj junction temperature − 125 °C Tamb operating ambient temperature −65 +125 °C |
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