CERAMIC CAPACITORS

10

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Page revised 02/21

Taping : dimensions

SMD TERMINATIONS

NON RoHS

COMPLIANT

Code

RoHS

COMPLIANT

Code

Magnetic

Recommended mounting process

Storage

(months)*

Epoxy

bonding

Iron

soldering

Wave

soldering

Vapor

phase

soldering

Infrared

soldering

Wire

bonding

Ag

Q

Ag

QW / P

No

••••

18

Ag/Pd/Pt

-

Ag/Pd/Pt

W / A

No

•••

24

Ag + Ni +

dipped Sn/Pb

60/40

T**

-

-

No

••••

24

Ag/Pd/Pt

+ dipped

Sn/Pb 60/40

H

Ag/Pd/Pt

+ dipped Sn

HW

No

•

24

Ag + Ni

+ electrolytic

Sn/Pb 95/5

C

Ag + Ni

+ electrolytic

Sn

CW / S

Yes

••••

18

Ag + Ni

+ electrolytic

Sn/Pb 60/40

D

-

-

Yes

••••

18

-

-

Ag + Cu

+ electrolytic

Sn

C***

No

••••

18

Ag + Ni

+ dipped

Sn/Pb 60/40

E

Ag + Ni

+ electrolytic

Sn

EW

Yes

••

24

Ag + Ni + Au

G

Ag + Ni + Au

GW

Yes

••••••

36

Ag + Polymer

+ Ni + Sn/Pb

95/5

YC

Ag + Polymer

+ Ni + Sn

YCW

Yes

••••

18

Ag + Polymer

+ Ni + Sn/Pb

60/40

YD

-

-

Yes

••••

18

Ag + Polymer

+ Ni + Au

YG

Ag + Polymer

+ Ni + Au

YGW

Yes

••••••

36

Nickel (Ni) or Copper (Cu) barriers amplify thermal shock and are not recommended for chip sizes larger than 3030.

*

Storage must be in a dry environment at a temperature of 20°C with a relative humidity below 50%, or preferably in a package enclosing a desiccant.

** Maintenance only.

*** Non magnetic chips series only.

SMD ENVIRONMENTAL TESTS

Ceramic chip capacitors for SMD are designed to meet test requirements of

CECC 32100 and NF C 93133 standards as specified below in compliance with

NF C 20700 and IEC 68 standards:

• Solderability: NF C 20758, 260°C, bath 62/36/2.

• Adherence: 5N force.

• Vibration fatigue test: NF C 20706, 20 g, 10 Hz to 2,000 Hz, 12 cycles of

20 minutes each.

• Rapid temperature change: NF C 20714, –55°C to + 125°C, 5 cycles.

• Combined climatic test: IEC 68-2-38.

• Damp heat: NF C 20703, 93 %, H.R., 40°C.

• Endurance test: 1,000 hours, 1.5 URC, 125°C.

STORAGE OF CHIP CAPACITORS

TINNED OR NON TINNED CHIP CAPACITORS

Storage must be in a dry environment at a temperature of 20°C with a relative

humidity below 50 %, or preferably in a packaging enclosing a desiccant.

STORAGE IN INDUSTRIAL ENVIRONMENT:

• 2 years for tin dipped chip capacitors,

• 18 months for tin electroplated chip capacitors,

• 2 years for non tinned chip capacitors,

• 3 years for gold plated chip capacitors.

STORAGE IN CONTROLLED NEUTRAL NITROGEN ENVIRONMENT:

• 4 years for tin dipped or electroplated chip capacitors,

• 4 years for non tinned chip capacitors,

• 5 years for gold plated chip capacitors.

Storage duration should be considered from delivery date and not from batch

manufacture date. The tests carried out at final acceptance stage (solderabili-

ty, susceptibility to solder heat) enable to assess the compatibility to surface

mounting of the chips.

User Guide