CERAMIC CAPACITORS

13

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Page revised 02/21

General characteristics

• leave the tip on the footprint for a few seconds in order to increase locally the

footprint’s temperature,

• use a cored wire solder and put it down on the iron tip. In a preferred way use

Sn/Pb/Ag 62/36/2 alloy,

• wait until the solder fillet is formed on the capacitor’s termination,

• take away iron and wire solder,

• wait a few minutes so that the substrate and capacitor come back down to

the preheating temperature,

• solder the second termination using the same procedure as the first,

• let the soldered component cool down slowly to avoid any thermal shock.

PACKAGING

TAPE AND REEL

The films used on the reels correspond to standard IEC 60286-3. Films are de-

livered on reels in compliance with document IEC 286-3 dated 1991.

Minimum quantity is 250 chips.

Maximum quantities per reel are as follows:

• Super 8 reel - Ø 180: 2,500 chips.

• Super 8 reel - Ø 330: 10,000 chips.

• Super 12 reel - Ø 180: 1,000 chips.

Reel marking complies with CECC 32100 standard:

• Model.

• Rated capacitance.

• Capacitance tolerance.

• Rated voltage.

• Batch number.

User Guide

Sizes

Nr. of chips/

package

Oriented chips

Dimensions in inches (in mm)

A

B

C

D

E

0402

100

No

Ø 0.112 (Ø 3.02)

0.065 (1.65)

0.167 (4.24)

2 (50.8)

0403

100

No

Ø 0.112 (Ø 3.02)

0.065 (1.65)

0.167 (4.24)

2 (50.8)

0504

100

Yes

0.059 (1.5)

0.045 (1.14)

0.035 (0.89)

0.167 (4.24)

2 (50.8)

0603

340

Yes

0.1 (2.54)

0.06 (1.52)

0.045 (1.14)

0.167 (4.24)

2 (50.8)

0805

100

Yes

0.1 (2.54)

0.06 (1.52)

0.045 (1.14)

0.167 (4.24)

2 (50.8)

1206

100

No

0.14 (3.56)

0.14 (3.56)

0.06 (1.52)

0.167 (4.24)

2 (50.8)

1210

100

Yes

0.14 (3.56)

0.14 (3.56)

0.06 (1.52)

0.167 (4.24)

2 (50.8)

1812

100

No

0.25 (6.35)

0.25 (6.35)

0.13 (3.3)

0.345 (8.76)

4 (101.6)

25

Yes

0.24 (6.1)

0.265 (6.73)

0.07 (1.78)

0.345 (8.76)

2 (50.8)

2220

100

Yes

0.25 (6.35)

0.25 (6.35)

0.13 (3.3)

0.345 (8.76)

4 (101.6)

25

Yes

0.24 (6.1)

0.265 (6.73)

0.07 (1.78)

0.345 (8.76)

2(50.8)

DIMENSIONAL CHARACTERISTICS OF CHIPS TRAY PACKAGES

HIGH Q CAPACITORS TAPE AND REEL PACKAGING SPECIFICATIONS

Chips tray depth: C

E

E

A

D

D

B

TRAY PACKAGES

Sizes

Type (1)

W±0.3

inches (mm)

F ±0.05

inches (mm)

P1 ±0.1

inches (mm)

T max.

inches (mm)

Reel Size

inches (mm)

Quantity per Reel

A (0505)

H

0,315 (8)

0,138 (3.5)

0,157 (4)

0,010 (0,25)

7,087 (180)

3’000

A (0505)

V

0,315 (8)

0,138 (3.5)

0,157 (4)

0,010 (0,25)

7,087 (180)

3’000

S (0603)

H

0,315 (8)

0,138 (3.5)

0,157 (4)

0,016 (0,4)

7,087 (180)

4’000

F (0805)

H

0,315 (8)

0,138 (3.5)

0,157 (4)

0,016 (0,4)

7,087 (180)

4’000

B (1111)

H

0,315 (8)

0,138 (3.5)

0,157 (4)

0,012 (0,3)

7,087 (180)

1’000

B (1111)

V

0,315 (8)

0,138 (3.5)

0,157 (4)

0,010 (0,25)

7,087 (180)

1’000

X (2225)

H

0,472 (12)

0,138 (5.5)

0,472 (12)

0,018 (0,45)

12,992 (330)

500

E (4040)

H

0,945 (24)

0,453±0,004 (11.5±0.1)

0,630 (16)

0,018 (0,45)

12,992 (330)

700

E (4040)

V

1,260 (32)

0,559±0,004 (14.2 ±0.1)

0,945 (24)

0,022 (0,55)

15 (381)

350

(1): Horizontal (H) or Vertical (V) orientation in cavities.