CERAMIC CAPACITORS

12

www.exxelia.com

Page revised 02/21

Taping : dimensions

SOLDERING ADVICES FOR REFLOW SOLDERING

Dimensions

in inches

(in mm)

Reflow soldering

Wave soldering

I1

I2

I3

I1

I2

I3

0402

0.043

(1.1)

0.035

(0.9)

0.012

(0.3)

0.043

(1.1)

0.047

(1.2)

0.012

(0.3)

0403

0.055

(1.4)

0.035

(0.9)

0.012

(0.3)

0.055

(1.4)

0.047

(1.2)

0.012

(0.3)

0504

0.063

(1.6)

0.051

(1.3)

0.016

(0.4)

0.063

(1.6)

0.063

(1.6)

0.016

(0.4)

0603

0.055

(1.4)

0.059

(1.5)

0.02

(0.5)

0.055

(1.4)

0.071

(1.8)

0.02

(0.5)

0805

0.073 (1.85) 0.065 (1.65) 0.024

(0.6)

0.073 (1.85) 0.077 (1.95) 0.024

(0.6)

0907

0.094

(2.4)

0.065 (1.65) 0.035

(0.9)

0.094

(2.4)

0.077 (1.95) 0.035

(0.9)

1005

0.073 (1.85) 0.067

(1.7)

0.039

(1)

0.073 (1.85) 0.079

(2)

0.039

(1)

1206

0.083

(2.1)

0.067

(1.7)

0.059

(1.5)

0.083

(2.1)

0.079

(2)

0.059

(1.5)

1210

0.118

(3)

0.069 (1.75) 0.059

(1.5)

0.118

(3)

0.081 (2.05) 0.059

(1.5)

1605

0.073 (1.85) 0.071

(1.8)

0.087

(2.2)

0.073 (1.85) 0.083

(2.1)

0.087

(2.2)

1806

0.087

(2.2)

0.073 (1.85) 0.102

(2.6)

0.087

(2.2)

0.085 (2.15) 0.102

(2.6)

1812

0.152 (3.85) 0.073 (1.85) 0.102

(2.6)

0.152 (3.85) 0.085 (2.15) 0.102

(2.6)

1825

0.281 (7.15) 0.073 (1.85) 0.102

(2.6)

0.281 (7.15) 0.085 (2.15) 0.102

(2.6)

2210

0.13

(3.3)

0.079

(2)

0.146

(3.7)

0.13

(3.3)

0.091

(2.3)

0.146

(3.7)

2220

0.228

(5.8)

0.079

(2)

0.146

(3.7)

0.228

(5.8)

0.091

(2.3)

0.146

(3.7)

2225

0.281 (7.15) 0.079

(2)

0.146

(3.7)

0.281 (7.15) 0.091

(2.3)

0.146

(3.7)

l2

l3

User Guide

Large chips above size 2225 are not recommended

to be mounted on epoxy board due to thermal ex-

pansion coefficient mismatch between ceramic ca-

pacitor and epoxy. Where larger sizes are required,

it is recommended to use components with ribbon

or other adapted leads so as to absorb thermo-me-

chanical strains.

RECOMMENDED FOOTPRINT FOR SMD CAPACITORS

Ceramic is by nature a material which is sensitive both thermally and mechan-

ically. Stresses caused by the physical and thermal properties of the capaci-

tors, substrates and solders are attenuated by the leads.

Wave soldering is unsuitable for sizes larger than 2220 and for the higher ends

of capacitance ranges due to possible thermal shock (capacitance values giv-

en upon request).

Infrared and vapor phase reflow, are preferred for high reliability applications

as inherent thermo-mechanical strains are lower than those inherent to wave

soldering.

Whatever the soldering process is, it is highly recommended to apply a thermal

cycle, see hereafter our recommended soldering profile:

Preheat zone

0

50

100

150

200

250

0

12

3

4

5

Time (min)

215°C

250°C

20°C

>50°C/s

Natural cool down

RoHS

No RoHS

0

50

100

150

200

250

0

12

3

4

5

Time (min)

20°C

215°C-225°C

245°C-255°C

Natural

cool down

RoHS

No RoHS

0

50

100

150

200

250

0

12

3

4

Time (min)

20°C

300

250°C

280°C

Natural cool down

RoHS

No RoHS

RECOMMENDED VAPOR PHASE REFLOW PROFILE

RECOMMENDED IR REFLOW PROFIL

RECOMMENDED WAVE SOLDERING PROFILE

SOLDERING ADVICES FOR IRON SOLDERING

Attachment with a soldering iron is discouraged due to ceramic brittleness and

the process control limitations. In the event that a soldering iron must be used,

the following precautions should be observed:

• Use a substrate with chip footprints big enough to allow putting side by side

one end of the capacitor and the iron tip without any contact between this tip

and the component,

• place the capacitor on this footprint,

• heat the substrate until the capacitor’s temperature reaches 150°C minimum

(preheating step, maximum 1°C per second),

• place the hot iron tip (a flat tip is preferred) on the footprint without

touching the capacitor. Use a regulated iron with a 30 watts maximum

power. The recommended temperature of the iron is 270 ±10°C. The tem-

perature gap between the capacitor and the iron tip must not exceed 120°C,