VITESSE

SEMICONDUCTOR CORPORATION

Preliminary Data Sheet

VSC7923

SONET/SDH 2.5Gb/s Laser Diode Driver

Page 8

G52203-0, Rev 3.0

05/11/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Figure 8: Pad Assignments for VSC7923 Die

NOTES:

1) Die size = 1620µm x 1620µm

2) Actual die size = 1720µm x 1720µm (after die are cut up)

3) Pad size = 120µm x 120µm

4) Pad pitch = 150µm

5) Space betwen pads = 30µm

PAD 25

PAD 24

PAD 23

PAD 22

PAD 21

PAD 20

PAD 19

PAD 18

VIB

GND0

OUT

OUT

GND0

NOUT

VSS

VSS

PAD 1

PAD 34 PAD 33 PAD 32 PAD 31 PAD 30 PAD 29 PAD 28 PAD 27 PAD 26

VREF

VSS

VSS

VSS

VSS

VIP

MIP

MIP

MIB

PAD 2

PAD 3

PAD 4

PAD 5

PAD 6

PAD 7

PAD 8

DIN

VSS

DIN

GND

GND

GND

VSS

VSS

PAD 9

PAD 10 PAD 11 PAD 12 PAD 13 PAD 14 PAD 15 PAD 16 PAD 17

N/C

N/C

GND

GND

GND

GND

GND

NMARK MARK

120

µm

120

150

µm

30

µm

1720

µm

1620

µm

1720

µm

1620

µm

50

µm

50

µm