ADCMP603

2

Rev. 0 | Page 14 of 16

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1

EXCEPT FOR EXPOSED PAD DIMENSION.

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

0.75

0.55

0.35

0.25 MIN

0.45

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

PIN 1

INDICATOR

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

*1.45

1.30 SQ

1.15

12

4

10

6

7

9

3

2.75

BSC SQ

3.00

BSC SQ

2

5

8

11

COPLANARITY

0.08

EXPOSED PAD

(BOTTOM VIEW)

SEATING

PLANE

Figure 25. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-12-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

ADCMP603BCPZ-WP

−40°C to +125°C

12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-12-1

G0D

1

ADCMP603BCPZ-R2

−40°C to +125°C

12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-12-1

G0D

1

ADCMP603BCPZ-R7

−40°C to +125°C

12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-12-1

G0D

1

Z = Pb-free part.

1