ADP2105/ADP2106/ADP2107

Rev. 0 | Page 5 of 32

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

IN, EN, SS, COMP, OUT_SENSE/FB to

AGND

−0.3 V to +6 V

LX1, LX2 to PGND

PWIN1, PWIN2 to PGND

−0.3 V to +6 V

PGND to AGND

−0.3 V to +0.3 V

GND to AGND

−0.3 V to +0.3 V

PWIN1, PWIN2 to IN

−0.3 V to +0.3 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA1

Unit

16-Lead LFCSP_VQ/QFN

40

°C/W

Maximum Power Dissipation

1

W

soldered in circuit board for surface mount packages.

BOUNDARY CONDITION

Natural convection, 4-layer board, exposed pad soldered to

the PCB.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.