AD8190

Rev. 0 | Page 23 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2

PIN 1

INDICATOR

TOP

VIEW

7.75

BSC SQ

8.00

BSC SQ

1

56

14

15

43

42

28

29

4.95

4.80 SQ

4.65

0.50

0.40

0.30

0.30

0.23

0.18

0.50 BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

6.50

REF

SEATING

PLANE

0.60 MAX

0.60 MAX

PIN 1

INDICATOR

COPLANARITY

0.08

0.05 MAX

0.02 NOM

0.30 MIN

EXPOSED

PAD

(BOTTOM VIEW)

NOTE:

THE AD8190 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF

THE DEVICE OVER THE FULL DVI/HDMI TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF

THE PACKAGE AND ELECTRICALLY CONNECTED TO AVEE. IT IS RECOMMENDED THAT NO PCB SIGNAL

TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE

SLUG. ATTACHING THE SLUG TO A AVEE PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE

DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.

Figure 36. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

8 mm × 8 mm Body, Very Thin Quad

(CP-56-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

Range

Package Description

Package

Option

Ordering

Quantity

AD8190ACPZ1

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-56-3

AD8190ACPZ-R71

−40°C to +85°C

56-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Reel

CP-56-3

750

AD8190-EVAL

Evaluation Kit