PPC5567MZP80R2 datasheet(16/56 Pages) FREESCALE

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MPC5567 Microcontroller Data Sheet, Rev. 0

Preliminary—Subject to Change Without Notice

Electrical Characteristics

Freescale Semiconductor

3.8.1

I/O Pad Current Specifications

The power consumption of an I/O segment depends on the usage of the pins on a particular segment. The

power consumption is the sum of all output pin currents for a particular segment. The output pin current

can be calculated from Table 10 based on the voltage, frequency, and load on the pin. Use linear scaling to

calculate pin currents for voltage, frequency, and load parameters that fall outside the values given in

Table 10.

1 | VDDA0–VDDA1 | must be < 0.1V

2 VPP can drop to 3.0 volts during read operations.

3 During standby operation. If standby operation is not required, VSTBY can be connected to ground.

4 Applies to CLKOUT, external bus pins, and Nexus pins.

5 Maximum average RMS DC current.

6 Average current measured on Automotive benchmark.

7 Peak currents may be higher on specialized code.

8 High use current measured while running optimized SPE assembly code with all code and data 100% locked in cache (0%

miss rate) with all channels of the eMIOS and eTPU running autonomously, plus the eDMA transferring data continuously from

SRAM to SRAM. Higher currents could be seen if an “idle” loop that crosses cache lines is run from cache. Code should be

written to avoid this condition.

9 Preliminary. Final specification pending characterization.

10 Power requirements for the VDD33 supply are dependent on the frequency of operation and load of all I/O pins, and the

voltages on the I/O segments. See Table 11 for values to calculate power dissipation for specific operation.

11 Power requirements for each I/O segment are dependent on the frequency of operation and load of the I/O pins on a particular

I/O segment, and the voltage of the I/O segment. See Table 10 for values to calculate power dissipation for specific operation.

The total power consumption of an I/O segment is the sum of the individual power consumptions for each pin on the segment.

12 Absolute value of current, measured at V

IL and VIH.

13 Absolute value of current, measured at V

IL and VIH.

14 Weak pull up/down inactive. Measured at VDDE = 3.6 V and VDDEH = 5.25 V. Applies to pad types: pad_fc, pad_sh, and

pad_mh.

15 Maximum leakage occurs at maximum operating temperature. Leakage current decreases by approximately one-half for each

8 to 12 oC, in the ambient temperature range of 50 to 125 oC. Applies to pad types: pad_a and pad_ae.

16 VSSA refers to both VSSA0 and VSSA1. | VSSA0–VSSA1 | must be < 0.1V

17 Up to 0.6 volts during power up and power down.

Table 10. I/O Pad Average DC Current1

Num

Pad Type

Symbol

Frequency

(MHz)

Load2

(pF)

Voltage (V)

Drive Select /

Slew Rate

Control

Current (mA)

1Slow

IDRV_SH

5.25

8.0

210

5.25

3.2

5.25

0.7

200

5.25

2.4

5Medium

IDRV_MH

5.25

17.3

620

5.25

6.5

3.33

5.25

1.1

3.33

200

5.25

3.9

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