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AT24CS32 数据表(PDF) 35 Page - Microchip Technology |
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AT24CS32 数据表(HTML) 35 Page - Microchip Technology |
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35 / 42 page ![]() For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: (c) L L1 θ VIEW A-A SHEET 1 protrusions shall not exceed 0.25mm per side. 1. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. Foot Angle Number of Leads Pitch Outside lead pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Lead Thickness Lead Width Notes: L1 θ b c Dimension Limits E E1 D L e1 A A2 A1 Units N e 0° 0.08 0.30 - - - 8° 0.20 0.50 MILLIMETERS 0.95 BSC 1.90 BSC 0.30 - 0.70 - 0.60 REF 2.90 BSC - 2.80 BSC 1.60 BSC 0.90 - - MIN 5 NOM 1.10 1.00 0.10 0.60 MAX REF: Reference Dimension, usually without tolerance, for information purposes only. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or Dimensioning and tolerancing per ASME Y14.5M © 2018 Microchip Technology Inc. Microchip Technology Drawing C04-21344 Rev B Sheet 2 of 2 5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT] Atmel Legacy Global Package Code TSZ AT24CS32 Packaging Information © 2020 Microchip Technology Inc. Datasheet DS20006341A-page 35 |
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