Nexperia

PCMFxUSB3BA/C series

Common-mode EMI filter for differential channels with integrated bidirectional ESD protection

11. Soldering

WLCSP5: Solder footprint and stencil aperture

PCMF1USB3BA/C

pcmf1usb3ba-c_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

SR

P

0.25

0.325

Hx

1.00

SL

0.25

SP

0.40

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

Hx

Hy

recommend stencil thickness: 0.1 mm

19-03-20

19-04-02

Fig. 23. Soldering footprint WLCSP5 (PCMF1USB3BA/C)

WLCSP10: Solder footprint and stencil aperture

PCMF2USB3BA/C

pcmf2usb3ba-c_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

P1

SR

P

0.80 0.25

0.325

Hx

1.80

SL

0.25

SP

0.40

19-03-20

19-04-02

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

P1

Hx

Hy

recommend stencil thickness: 0.1 mm

Fig. 24. Soldering footprint WLCSP10 (PCMF2USB3BA/C)

PCMFXUSB3BA_C_SER

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Nexperia B.V. 2020. All rights reserved

Product data sheet

Rev. 4 — 12 May 2020

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