Nexperia

PCMFxUSB3BA/C series

Common-mode EMI filter for differential channels with integrated bidirectional ESD protection

WLCSP15: Solder footprint and stencil aperture

PCMF3USB3BA/C

pcmf3usb3ba-c_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

P1

SR

P

0.80 0.25

0.325

Hx

2.60

SL

0.25

SP

0.40

19-03-20

recommend stencil thickness: 0.1 mm

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

P1

Hx

Hy

Fig. 25. Soldering footprint WLCSP15 (PCMF3USB3BA/C)

PCMFXUSB3BA_C_SER

All information provided in this document is subject to legal disclaimers.

©

Nexperia B.V. 2020. All rights reserved

Product data sheet

Rev. 4 — 12 May 2020

17 / 19