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112A-TAAR-R03 数据表(PDF) 4 Page - ATTEND Technology Inc.

部件名 112A-TAAR-R03
功能描述  This specification covers the requirements for product performance, test methods and quality assurance provisions of 112A-TAAR-R03.
PDF  5 Pages
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制造商  ATTEND [ATTEND Technology Inc.]
网页  https://www.attend.com.tw/index.php
标志 ATTEND - ATTEND Technology Inc.

112A-TAAR-R03 数据表(HTML) 4 Page - ATTEND Technology Inc.

  112A-TAAR-R03 Datasheet HTML 1Page - ATTEND Technology Inc. 112A-TAAR-R03 Datasheet HTML 2Page - ATTEND Technology Inc. 112A-TAAR-R03 Datasheet HTML 3Page - ATTEND Technology Inc. 112A-TAAR-R03 Datasheet HTML 4Page - ATTEND Technology Inc. 112A-TAAR-R03 Datasheet HTML 5Page - ATTEND Technology Inc.  
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SPECIFICATION AND PERFORMANCE
SERIES:
112A-TAAR-R03
FILE:
112A-TAAR-R03_spec
DATE:
2012/09/12
The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有;非經同意,不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。
-4 -
Humidity
Finish
1. Contact Resistance:
80mΩ(Max)
2. Insulation
Resistance:
100MΩ(Min)
Humidity storage at +40ºC with 90~95% RH for 96
hours. Upon completion of the exposure period, the
test specimens shall be conditions for 1 of 2 hrs, then
10 mating cycles while.
(EIA364-31)
Salt Spray
Finish
1. Contact Resistance:
80mΩ(Max)
2 .No Damage
5 ± 1% salt solutions, at 35 ± 2ºC duration 48 hours.
Connectors detached
(MIL-STD-1344)
SOLDER ABILITY
Item
Requirement
Test Condition
Solder ability
95%of immersed area
must show no voids ,
pin holes.
Dip solder tails into the molten solder(held at
230±5℃) up to 0.5mm from the tip of tails for 3±0.5
seconds.
(MIL-STD-202 METHOD 208)
Resistance to soldering
heat
No melting, cracks or
functional damage
allowed
All connectors designed for PCB soldering within this
specification must be able to withstand the heat from
solder oven according to the graph below. The cycle
should be repeated twice.
(MIL-STD-202 METHOD 210)



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