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112A-TAAR-R03 数据表(PDF) 3 Page - ATTEND Technology Inc.

部件名 112A-TAAR-R03
功能描述  This specification covers the requirements for product performance, test methods and quality assurance provisions of 112A-TAAR-R03.
PDF  5 Pages
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制造商  ATTEND [ATTEND Technology Inc.]
网页  https://www.attend.com.tw/index.php
标志 ATTEND - ATTEND Technology Inc.

112A-TAAR-R03 数据表(HTML) 3 Page - ATTEND Technology Inc.

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SPECIFICATION AND PERFORMANCE
SERIES:
112A-TAAR-R03
FILE:
112A-TAAR-R03_spec
DATE:
2012/09/12
The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有;非經同意,不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。
-3 -
Shock
Finish
1. No electrical
discontinuity more
than 0.1μs.
2 .No Damage
3. Contact Resistance:
80mΩ(Max)
Solder connectors on PCB and mate them together,
subject to he following shock conditions, 3 shocks shall
be period along 3 mutually perpendicular axis, passing
DC 1mA current during the test.
1 axis, plus-minus direction, core 3
times.(total:18times) 490m/s2
(MIL-STD-202 METHOD 213)
Card Insertion / Eject Force
9.8N(Max)
Push the card at the speed rate 25 ± 3 mm/minute.
Card Release Force
2N+/-1N
From the state of the card lock, Pull the card at the
speed rate 25 ± 3 mm/minute.
Push in strength
No Damage
The card inserted in positive and the opposite direction
and the load of 19.6N is added
ENVIRONMENTAL
Item
Requirement
Test Condition
Temperature Cycle
Finish
1. Contact Resistance:
80mΩ(Max)
2. Insulation
Resistance:
100MΩ(Min)
Test time: 6 cycles (JIS C0025)
Stage
Temp
Time
t1
-55 C
30 min
t2
-55~+90 C
3 min
t3
+ 90 C
30 min
t4
+90~-55 C
3 min
Heat Resistance
Finish
1. Contact Resistance:
80mΩ(Max)
2. Insulation
Resistance:
100MΩ(Min)
Solder connectors on PCB and mate them together,
expose to 90
C
0
2
±
for 96hrs. Upon completion of the
exposure period, the test specimens shall be
conditioned at ambient room conditions for 1 of 2hrs,
after which the specified measurements shall be
performed.(MIL-STD-202 METHOD 108)
Cold Resistance
Finish
1. Contact Resistance:
80mΩ(Max)
2. Insulation
Resistance:
100MΩ(Min)
Solder connectors on PCB and mate them together,
expose to -55
C
0
3
±
for 96hrs. Upon completion of the
exposure period, the test specimens shall be
conditioned at ambient room conditions for 1 of 2hrs,
after which the specified measurements shall be
performed.
(EIA364-59)
t1
t2
t3
t4



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