SPECIFICATION AND PERFORMANCE

SERIES:

DDR Series

FILE:

DDR Series_spec

DATE:

2013/01/04

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-5 -

Salt Spray

Detrimental damage

affecting to the

performance shall not

occur.

Solder connectors on PCB and mate them

together, subject to the following salt mist.

Upon completion of the exposure period,

salt deposits shall be removed by gentle

wash or dip in running water, after which

the specified measurements shall be

performed.

NaCl solution:

a) Concentration: 5±1 %

b) Spray time:

48±4h

c) Ambient Temperature : 35±1℃

SO2 Gas

Detrimental damage

affecting to the

performance shall not

occur.

Solder connectors on PCB and mate them

together, expose to 10ppm SO2 gas,

ambient temperature 25±2 ℃ for 24

Hours.

SOLDER ABILITY

Item

Requirement

Test Condition

Solderability

More then 95% of the

dipped surface shall

be wet evenly with

new solder.

The solder time of connector in the solder

bath at 230±5℃ for 3±0.5 sec. After

immersing solder tine in the flux for 5 to 10

seconds

Solder heat

resistance

Detrimental damage

affecting to the

performance shall not

occur.

180～200℃ for 120 seconds. Max

220℃ for 60 sec. Max

Peak：255±5℃ 10 sec. Max