MP6973

– FAST TURN-OFF INTELLIGENT RECTIFIER

MP6973 Rev. 1.0

www.MonolithicPower.com

3

6/17/2020

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© 2020 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Description

1, 4

VS

MOSFET source. VS is also used as a reference for VDD.

2

HVC

HV linear regulator input.

3

SENSE

MOSFET drain voltage sensing.

5

VDD

Linear regulator output. VDD is the power supply of IC.

6, 7, 8

VD

MOSFET drain.

ABSOLUTE MAXIMUM RATINGS (1)

VDD to VS ....................................-0.3V to +14V

VD to VS .....................................-1.5V to +100V

SENSE, HVC to VS .......................-1V to +180V

Continuous drain current (TC = 25°C) ....... 14.1A

Continuous drain current (TC = 100°C) ....... 8.9A

Pulsed drain current (2) ................................. 50A

Maximum power dissipation (3)................... 1.8W

Junction temperature ................................150°C

Lead temperature (solder) ........................260°C

Storage temperature ............... -55°C to +150°C

ESD Rating

Charged device model (CDM) ............... ±2000V

Recommended Operation Conditions (4)

VDD to VS ....................................... 4.5V to 13V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (5)

θJA

θJC

SOIC-8.................................... 67 ...... 30... °C/W

Notes:

1)

Exceeding these ratings may damage the device.

2)

Repetitive rating: Pulse width = 100µs, duty cycle limited by

maximum junction temperature.

3)

TA = 25°C. The maximum allowable power dissipation is a

function of the maximum junction temperature TJ (MAX), the

junction-to-

ambient thermal resistance θ

JA, and the ambient

temperature TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation produces an excessive die

temperature, causing the regulator to go into thermal

shutdown. Internal thermal shutdown circuitry protects the

device from permanent damage.

4)

The device is not guaranteed to function outside of its

operating conditions.

5)

Measured on JESD51-7, 4-layer PCB.