UPD6708 datasheet(71/74 Pages) RENESAS

71 / 74 page

µPD6708

11. RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the conditions recommended in the table below.

For details of recommended soldering conditions, refer to the information document Semiconductor Device Mounting

Technology Manual (IEI-1207).

For soldering methods and conditions other than those recommended, please contact NEC representative.

Table 11-1. Surface Mount Type Soldering Conditions

µPD6708GS : 16-pin plastic SOP (300 mil)

Caution Use of more than one soldering method should be avoided (except for partial heating).

Table 11-2. Hole-Through Type Soldering Conditions

µPD6708CX : 16-pin plastic DIP (300mil)

Soldering Method

Soldering Conditions

Wave soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less

(pin only)

Partial heating

Pin temperature: 300

°C or below, Flow time: 3 seconds or less (per pin)

Caution Wave soldering is used on the pin only, and care must be taken to prevent solder from coming into direct

contact with the package body.

Soldering Method

Soldering Conditions

Symbol

Infrared ray reflow

Package peak temperature: 230

°C, Reflow time: 30 seconds or less (at 210 °C or

IR30-00-1

higher), Number of reflow processes: 1

VPS reflow

Package peak temperature: 215

°C, Reflow time: 40 seconds or less (at 200 °C or

VP15-00-1

higher), Number of reflow processes: 1

Partial heating

Pin temperature: 300

°C or below, Flow time: 3 seconds or less (per side of device)

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