Nexperia

PESDxUSB3B/C series

ESD protection for differential data lines

3. Ordering information

Table 3. Ordering information

Package

Type number

Name

Description

PESD1USB3B/C

WLCSP5

wafer level chip-size package; 5 bumps (2-1-2)

PESD2USB3B/C

WLCSP10

wafer level chip-size package; 10 bumps (4-2-4)

PESD3USB3B/C

WLCSP15

wafer level chip-size package; 15 bumps (6-3-6)

4. Marking

Table 4. Marking codes

Type number

Marking code

PESD1USB3B/C

PD1B

PESD2USB3B/C

PD2B

PESD3USB3B/C

PD3B

5. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VI

input voltage

-4

4

V

IEC 61000-4-2, level 4; all

input pins to ground

• contact discharge

-20

20

kV

• air discharge

-20

20

kV

IEC 61000-4-2, level 4; all

output pins to ground

• contact discharge

-2

2

kV

VESD

electrostatic discharge

voltage

• air discharge

-2

2

kV

IPPM

rated peak-pulse

current

tp = 8/20 μs

-9.5

9.5

A

Tstg

storage temperature

-40

+125

°C

Tamb

ambient temperature

-40

+125

°C

PESDXUSB3B_C_SER

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© Nexperia B.V. 2019. All rights reserved

Product data sheet

Rev. 2 — 29 January 2019

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