Nexperia

PESDxUSB3B/C series

ESD protection for differential data lines

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

PESD3USB3B/C

pesd3usb3b-c_po

Unit

mm

max

nom

min

0.64 0.42

2.42 1.22

0.80

A

Dimensions (mm are the original dimensions)

WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)

PESD3USB3B/C

A1

b

0.31

D

E

e

e1

e2

0.80

e3

0.61 0.41

2.37 1.17 0.40 0.40

0.26

0.58 0.40

2.32 1.12

0.21

0

1 mm

scale

detail X

A

A1

D

E

bump A1

index area

bump A1

index area

X

e2

e

e1

e3

b

1

2

4

3

6

5

A

B

C

1/2 e

B1

B2

B3

18-05-16

Fig. 21. Package outline WLCSP15

PESDXUSB3B_C_SER

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© Nexperia B.V. 2019. All rights reserved

Product data sheet

Rev. 2 — 29 January 2019

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