Nexperia

PESDxUSB3B/C series

ESD protection for differential data lines

9. Soldering

WLCSP5: Solder footprint and stencil aperture

PESD1USB3B/C

pesd1usb3b-c_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

SR

P

0.25

0.325

Hx

1.00

SL

0.25

SP

0.40

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

Hx

Hy

recommend stencil thickness: 0.1 mm

18-05-16

Fig. 22. Soldering footprint WLCSP5 (PESD1USB3B/C)

WLCSP10: Solder footprint and stencil aperture

PESD2USB3B/C

pesd2usb3b-c_fr

solder resist opening (SR)

occupied area

solder land plus solder paste

solder paste deposit (SP)

solder land (SL)

Dimensions in mm

P1

SR

P

0.80 0.25

0.325

Hx

1.80

SL

0.25

SP

0.40

18-05-16

Hy

1.40

SL = SP

SR

detail X

see

detail X

P

P

P1

Hx

Hy

recommend stencil thickness: 0.1 mm

Fig. 23. Soldering footprint WLCSP10 (PESD2USB3B/C)

PESDXUSB3B_C_SER

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© Nexperia B.V. 2019. All rights reserved

Product data sheet

Rev. 2 — 29 January 2019

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