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MAS9078 数据表(PDF) 10 Page - Micro Analog systems

部件名 MAS9078
功能描述  AM Receiver IC
PDF  10 Pages
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制造商  MAS [Micro Analog systems]
网页  http://www.mas-oy.com
标志 MAS - Micro Analog systems

MAS9078 数据表(HTML) 10 Page - Micro Analog systems

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DA9078.003
28 January 2004
10 (10)
ORDERING INFORMATION
Product Code
Product
Package
Capacitance Option
MAS9078BTB1
AM-Receiver IC
EWS-tested wafer, Thickness 480 µm
CC = 0.75 pF (Nominal)
MAS9078BTB2
AM-Receiver IC
EWS-tested wafer, Thickness 480 µm
CC = 1.25 pF
MAS9078BTB3
AM-Receiver IC
EWS-tested wafer, Thickness 480 µm
CC = 1.625 pF
MAS9078BTB4
AM-Receiver IC
EWS-tested wafer, Thickness 480 µm
CC = 2.5 pF
MAS9078BTB5
AM-Receiver IC
EWS-tested wafer, Thickness 480 µm
CC = 3.875 pF
MAS9078BTC1
AM-Receiver IC
EWS-tested wafer, Thickness 400 µm
CC = 0.75 pF
MAS9078BTC2
AM-Receiver IC
EWS-tested wafer, Thickness 400 µm
CC = 1.25 pF
MAS9078BTC3
AM-Receiver IC
EWS-tested wafer, Thickness 400 µm
CC = 1.625 pF
MAS9078BTC4
AM-Receiver IC
EWS-tested wafer, Thickness 400 µm
CC = 2.5 pF
MAS9078BTC5
AM-Receiver IC
EWS-tested wafer, Thickness 400 µm
CC = 3.875 pF
MAS9078BUA1-T
AM-Receiver IC
TSSOP-16, Tape & Reel
CC = 0.75 pF (Nominal)
Contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
Tel. +358 9 80 521
Fax +358 9 805 3213
http://www.mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown
in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that
the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog
Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.



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