6 (7)

DA9187.002

29 January, 2004

PACKAGE (TSSOP-20) OUTLINES

Symbol

Min

Nom

Max

Unit

A

--

--

1.10

mm

A1

0.05

--

0.15

mm

A2

0.85

0.90

0.95

mm

b

0.19

--

0.30

mm

b1

0.19

0.22

0.25

mm

c

0.09

--

0.20

mm

c1

0.09

--

0.16

mm

D

6.40

6.50

6.60

mm

E

6.4 BSC

mm

E1

4.30

4.40

4.50

mm

e

0.65 BSC

mm

L

0.50

0.60

0.75

mm

L1

1.00 REF

R

0.09

--

--

mm

S

--

0.20

--

mm

Dimensions do not include mold or interlead flash, protrusions or gate burrs.

Reference Standard : JEDEC MO-153 .

SOLDERING INFORMATION

Resistance to Soldering Heat

According to RSH test IEC 68-2-58/20 2*220

°C

Maximum Temperature

240

°C

Maximum Number of Reflow Cycles

2

Reflow profile

Thermal profile parameters stated in JESD22-A113 should not

Seating Plane Co-planarity

max 0.08 mm

Lead Finish

Solder plate 7.62 - 25.4

µm, material Sn 85% Pb 15%

b

b

R

A

A

VIEW A-A

B

B

E

E1

e

A

A2

A1

D

b

c

c1

b1

GAUGE PLANE

0.25

VIEW B-B

12° REF

12° REF

L

L1

S

INDEX AREA

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