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RT6310A/AH 数据表(PDF) 41 Page - Richtek Technology Corporation |
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RT6310A/AH 数据表(HTML) 41 Page - Richtek Technology Corporation |
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41 / 54 page ![]() RT6310 Copyright © 2023 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. DS6310-04 August 2023 www.richtek.com 41 OUT ON IN SW V t = Vf ON MAX ON OFF_MIN t D = t + t The worst-case output sag voltage is determined by : ( ) 2 L_PEAK OUT_SAG OUT IN MAX OUT LI V = 2 C V D V − When the load is removed, the amount of overshoot due to stored inductor energy is calculated as : 2 L_PEAK OUT_SOAR OUT OUT LI V = 2 C V Ceramic capacitors have very low equivalent series resistance (ESR) and provide the best ripple performance. Be careful to consider the voltage coefficient of ceramic capacitors when choosing the value and case size. Most ceramic capacitors lose 50% or more of their rated value when used near their rated voltage. Internal VCC Regulator (VCC) Good bypassing at VCC pin is necessary to supply the high transient currents required by the MOSFET gate drivers. Place a low ESR MLCC capacitor (C = 1 F/0603) as close as possible to VCC pin and AGND pin. Applications with high input voltage and high switching frequency will increase die temperature because of the higher power dissipation across the LDO. Do not connect VCC pin to provide power to other devices or loads. External Bootstrap Capacitor and Resistor (CBOOT and RBOOT) Connect a 0.1 F/0603 low ESR ceramic capacitor and 10 resistor between BOOT pin and LX pin. This bootstrap capacitor provides the gate driver supply voltage for the high-side MOSFET. The internal gate driver is optimized to turn the high-side MOSFET on fast enough for low power loss and good efficiency, but also slow enough to reduce EMI. The most of EMI occurs since VLX rises rapidly when the high-side MOSFET is turned on fast. In some cases, slightly increasing the RBOOT reduces EMI and LX pin spike directly, but the switching loss of high-side MOSFET and die/case temperature are also increased. Output Voltage Programming For the RT6310A/AH/D/DH, an external resistive divider sets the output voltage according to the following equation : OUT REF R1 V = 1 + V R2 FB VOUT RT6310A/AH RT6310D/DH R1 R2 AGND Figure 15. Output Voltage Setting The recommended R2 is set to around 40k . For a given R2, the resistance of R1 is calculated as below : ( ) OUT REF REF R2 V V R1 = V − 1% resistors are recommended to maintain output voltage accuracy. Besides, the resistor divider generates a small load on the output, which influences the light-load efficiency. The total resistance of the FB resistor divider should be as large as possible when good light-load efficiency is desired. Place resistors R1 and R2 very close to the FB pin to minimize PCB trace length and noise. Great care should be taken to route the FB trace away from noise sources, such as the inductor or the LX trace. For better transient and stability performance, it is recommended to add CFF. Feedforward Capacitor CFF Design To save time for compensator design and to reduce the layout area through external components, the components of compensator are integrated in the IC. However, this integrated compensator might not be suitable for every load transient specification. Hence, to make RT6310 more adaptable, the feedforward |
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