MBR340

http://onsemi.com

3

0

2.0

1.0

3.0

4.0

5.0

0.5

1.0

1.5

2.0

2.5

20

(CAPACITIVE LOAD)

10

dc

I PK

+ 5.0

SQUARE

WAVE

020

10

30

40

50

70

60

300

400

500

200

90

80

50

100

RESISTIVE LOAD

Figure 4. Power Dissipation

Figure 5. Typical Capacitance

+ p

Data shown for thermal resistance junction−to−ambient

guideline values for preliminary engineering, or in case the

tie point temperature cannot be measured.

1

2

3

Mounting

Method

Lead Length, L (in)

1/8

1/4

1/2

3/4

50

51

53

55

°C/W

°C/W

°C/W

58

59

61

63

28

NOTE 5 — MOUNTING DATA

Mounting Method 1

P.C. Board where available

copper surface is small.

L

L

L

Mounting Method 2

Vector Push−In

Terminals T−28

L

Mounting Method 3

P.C. Board with

2−1/2

″ X 2−1/2″

copper surface.

L = 1/2’’

Board Ground Plane