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MP6605C 数据表(PDF) 12 Page - MPS Industries, Inc.

部件名 MP6605C
功能描述  4-Channel, Low-Side Driver with I2C Interface
PDF  16 Pages
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制造商  MPSIND [MPS Industries, Inc.]
网页  http://www.mpsind.com/index.html
标志 MPSIND - MPS Industries, Inc.

MP6605C 数据表(HTML) 12 Page - MPS Industries, Inc.

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MP6605C
– 4-CHANNEL LOW-SIDE DRIVER WITH I2C INTERFACE
MP6605C Rev. 1.0
MonolithicPower.com
12
7/11/2022
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2022 MPS. All Rights Reserved.
APPLICATION INFORMATION
Selecting External Components
A 100nF, X7R ceramic bypass capacitor must be
placed at the VIN pin. An additional, 4.7µF
minimum ceramic capacitor should be placed
nearby. If the device is located far from the
power
source,
additional
electrolytic
bulk
capacitance may be needed.
When the current is turned off, the VCLAMP pin
dissipates the energy in an inductive load.
Depending on the application, VCLAMP can be
connected directly to VIN, or it can be connected
to VIN with a TVS diode.
Connecting VCLAMP to VIN is equivalent to
connecting a diode from each output to VIN. The
TVS diode allows the voltage on the output pins
to exceed VIN until the TVS diode breaks down.
This increased voltage allows the
current
through the load to decay faster, which is
generally required for high-speed operation with
unipolar stepper motors.
The
TVS diode’s breakdown voltage should be
selected such that the VCLAMP pin remains
below its maximum ratings. Note that the TVS
diode’s breakdown voltage may be higher than
expected as this voltage is rated at low currents.
For VIN supply voltages up to 24V, it is
recommended to use a 24V TVS diode. This
ensures that the VCLAMP pin voltage stays
within its limits.
PCB Layout Guidelines
Efficiency PCB layout is vital for stable operation.
For the best results, refer for Figure 5 and follow
the guidelines below:
1. Place the bypass capacitors near the IC.
2. If used, place the VCLAMP TVS diode near
the IC.
3. Place thermal vias under the exposed pad to
help move heat from the device to a plane on
an inner layer, or on the back side of the
PCB.
Figure 5: Recommended PCB Layout



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