AD8332ACP-R2 datasheet(40/40 Pages) AD

40 / 40 page

AD8331/AD8332/AD8334

Rev. E | Page 40 of 40

*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4

EXCEPT FOR EXPOSED PAD DIMENSION

PIN 1

INDICATOR

TOP

VIEW

8.75

BSC SQ

9.00

BSC SQ

0.45

0.40

0.35

0.50 BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

7.50

REF

0.05 MAX

0.02 NOM

0.60 MAX

*4.85

4.70 SQ

4.55

EXPOSED PAD

(BOTTOM VIEW)

0.30

0.25

0.18

SEATING

PLANE

PIN 1

INDICATOR

THE EXPOSE PAD IS NOT CONNECTED

INTERNALLY. FOR INCREASED RELIABILITY

OF THE SOLDER JOINTS AND MAXIMUM

THERMAL CAPABILITY IT IS RECOMMENDED

THAT THE PAD BE SOLDERED TO

THE GROUND PLANE.

Figure 98. 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

9 mm × 9 mm Body, Very Thin Quad

(CP-64-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD8331ARQ

–40°C to +85°C

20-Lead Shrink Small Outline Package (QSOP)

RQ-20

AD8331ARQ-REEL

–40°C to +85°C

20-Lead Shrink Small Outline Package (QSOP)

RQ-20

AD8331ARQ-REEL7

–40°C to +85°C

20-Lead Shrink Small Outline Package (QSOP)

RQ-20

AD8331ARQZ1

–40°C to +85°C

20-Lead Shrink Small Outline Package (QSOP)

RQ-20

AD8331ARQZ-RL1

–40°C to +85°C

20-Lead Shrink Small Outline Package (QSOP)

RQ-20

AD8331ARQZ-R71

–40°C to +85°C

20-Lead Shrink Small Outline Package (QSOP)

RQ-20

AD8331-EVAL

Evaluation Board with AD8331ARQ

AD8332ACP-R2

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2

AD8332ACP-REEL

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2

AD8332ACP-REEL7

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2

AD8332ACPZ-R71

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2

AD8332ACPZ-RL1

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2

AD8332ARU

–40°C to +85°C