1999 Dec 23

10

Philips Semiconductors

Preliminary specification

High dynamic range dual LNA MMIC

CGY2105ATS

PACKAGE OUTLINE

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.15

0.00

1.4

1.2

0.32

0.20

0.25

0.13

5.30

5.10

4.5

4.3

0.65

6.6

6.2

0.65

0.45

0.48

0.18

10

0

o

o

0.13

0.2

0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

0.75

0.45

1.0

SOT369-1

94-04-20

95-02-04

θ

A

D

y

Q

detail X

E

Z

e

c

L

X

(A )

3

A

0.25

18

16

9

pin 1 index

0

2.5

5 mm

scale

SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm

SOT369-1

A

max.

1.5