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CGY2105ATS 数据表(PDF) 3 Page - NXP Semiconductors |
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CGY2105ATS 数据表(HTML) 3 Page - NXP Semiconductors |
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3 / 16 page ![]() 1999 Dec 23 3 Philips Semiconductors Preliminary specification High dynamic range dual LNA MMIC CGY2105ATS PINNING SYMBOL PIN DESCRIPTION VS2 1, 2, 14 and 15 amplifier 2 source IN2 3 amplifier 2 input n.c. 4 not connected n.c. 5 not connected IN1 6 amplifier 1 input VS1 7, 8, 10 and 11 amplifier 1 source OUT1 9 amplifier 1 drain output VG1 12 amplifier 1 gate bias VG2 13 amplifier 2 gate bias OUT2 16 amplifier 2 drain output handbook, halfpage CGY2105ATS FCA097 1 2 3 4 5 6 7 8 VS2 VS2 IN2 n.c. n.c. IN1 VS1 VS1 OUT2 VS2 VS2 VG2 VG1 VS1 VS1 OUT1 16 15 14 13 12 11 10 9 Fig.2 Pin configuration. LIMITING VALUES THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDS drain-source voltage −− 5V VGS gate-source voltage −3 − +1 V VDG drain-gate voltage −− 7V Vsupply positive supply voltage see Chapter “Application and test information” −− 6V Vneg negative supply voltage see Chapter “Application and test information” −6 −− V Tamb ambient temperature −40 − +85 °C Tj junction temperature −− 150 °C Tstg storage temperature −− 150 °C Ptot total power dissipation Tamb <85 °C −− 430 mW SYMBOL PARAMETER VALUE UNIT Rth(j-a) thermal resistance from junction to ambient 138 K/W |
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