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ADRF5700BCCZN-R7 数据表(PDF) 6 Page - Analog Devices |
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ADRF5700BCCZN-R7 数据表(HTML) 6 Page - Analog Devices |
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6 / 16 page ![]() Data Sheet ADRF5700 ABSOLUTE MAXIMUM RATINGS analog.com Rev. 0 | 6 of 16 Table 4. Absolute Maximum Ratings Parameter Rating VDD −0.3 V to +3.6 V VSS −3.6 V to +0.3 V Digital Control Inputs Voltage −0.3 V to VDD + 0.3 V Current 3 mA RF Input Power, Dual Supply1 (VDD = 3.3 V, VSS = −3.3 V, Frequency = 100 MHz to 20 GHz, TCASE = 85°C2) Steady State, Average 25 dBm Steady State, Peak 31 dBm Hot Switching, Average 25 dBm Hot Switching, Peak 28 dBm RF Input Power, Single Supply1 (VDD = 3.3 V, VSS = 0 V, Frequency = 100 MHz to 20 GHz, TCASE = 85°C2) Steady State, Average 16 dBm Steady State, Peak 16 dBm Hot Switching, Average 16 dBm Hot Switching, Peak 16 dBm RF Power Under Unbiased Condition (VDD and VSS = 0 V) Input at ATTIN or ATTOUT 11 dBm Temperature Junction (TJ) 135°C Storage −65°C to +150°C Reflow 260°C 1 For power derating over frequency, see Figure 2 and Figure 3. Applicable for all ATTIN and ATTOUT power specifications. 2 For 105°C operation, the power handling degrades from the TCASE = 85°C specifications by 3 dB. Stresses at or above those listed under absolute maximum ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction to case bottom (channel to package bottom) thermal resistance. Table 5. Thermal Resistance Package Type θJC1 Unit C-20-9 200 °C/W 1 θJC was determined by simulation under the following conditions: the heat transfer is due solely to the thermal conduction from the channel through the ground pad to the PCB, and the ground pad is held constant at the operating temperature of 85°C. POWER DERATING CURVES Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C |
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