September 12, 2006 21195E5

Am29F017D

39

DA TA

SH EET

Revision E (May 19, 2000)

Global

Changed part number to Am29F017D. This reflects the

new 0.23 µm process technology upon which this de-

vice will now be built.

The Am29F016D is compatible with the previous 0.32

µm Am29F016B device, with the exception of the sec-

tor group protect and unprotect algorithms. These algo-

rithms are provided in a seperate document. Contact

AMD for more information or to request a copy of that

document.

The data sheet will be marked preliminary until the de-

vice has been in full production for a number of months.

The burn-in option is no longer available.

The device now has the Unlock Bypass Program fea-

ture.

The publication number of the document describing

sector protection/unprotection implementation is now

23923.

Revision E+1 (December 5, 2000)

Added table of contents. Removed Preliminary status

from the document.

Revision E+2 (March 23, 2001)

Common Flash Memory Interface (CFI)

Added section.

Table 9, Am29F017D Command Definitions

Added Note 9 and CFI Query command to table.

Revision E+3 (July 29, 2005)

Common Flash Memory Interface (CFI)

Added section.

Updated Valid Combinations

Updated Valid Combinations to include Pb-free PLCC

& PDIP packages.

Revision E+4 (January 5, 2006)

Deleted TSR040 40-pin Reverse TSOP and TSR048

48-pin Reverse TSOP options.

Revision E5 (May 9, 2006)

Added migration and obsolescence information.

Revision E6 (September 12, 2006)

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-

vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-

sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products

Trademarks

Copyright ©2002-2005 Advanced Micro Devices, Inc. All rights reserved.

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

ExpressFlash is a trademark of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

Copyright ©2006 Spansion, Inc. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are trademarks of Span-

sion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.