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AM29F080B 数据表(PDF) 39 Page - Advanced Micro Devices |
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AM29F080B 数据表(HTML) 39 Page - Advanced Micro Devices |
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39 / 39 page ![]() November 1, 2006 21503G5 Am29F080B 37 D A TA SH EE T Revision G+1 (January 3, 2002) Global Changed -75 speed option to -70 (70 ns, VCC = 5.0 ± 10 %). Added -55 (55 ns, VCC = 5.0 V ± 5%) speed option. Revision G+2 (June 14, 2004) Ordering Information Added Pb-free OPNs. Revision G3 (December 22, 2005) Global Deleted 150 ns speed option and reverse TSOP pack- age option. Revision G4 (May 19, 2006) Added “Not recommended for new designs” note. AC Characteristics Changed tBUSY specification to maximium value. Revision G5 (November 1, 2006) Deleted “Not recommended for new designs” note. Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita- tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con- templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au- thorization by the respective government entity will be required for export of those products. Trademarks Copyright © 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners. Copyright © 2004–2006 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, ExpressFlash, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. |
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