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AM29BL162C 数据表(PDF) 14 Page - Advanced Micro Devices |
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AM29BL162C 数据表(HTML) 14 Page - Advanced Micro Devices |
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14 / 52 page ![]() 10 Am29BL162C 22142F9 January 22, 2007 D A TA SH EET Burst Suspend/Burst Resume Operations The device offers Burst Suspend and Burst Resume operations. When both OE# and BAA# are taken high, the device removes (“suspends”) the data from the outputs (because OE# is high), but “holds” the data internally. The device resumes burst operation when either OE# and/or BAA# is asserted low. Asserting the OE# only causes the device to present the same data that was held during the Burst Suspend operation. As long as BAA# is high, the device continues to output that word of data. Asserting both OE# and BAA# low resumes the burst operation, and on the next rising edge of CLK, increments the counter and outputs the next word of data. IND# End of Burst Indicator The IND# output signal goes low when the device is outputting the last word of a 32-word burst sequence (word Da+31). When the starting address was loaded with LBA#, the 5-bit burst address counter was set to 00000b. The counter increments to 11111b on the 32nd word in the burst sequence. If the system con- tinues to assert BAA# low, on the next CLK the device outputs the starting address data (Da). The burst address counter is again set to 00000b, and is “wrapped around.” Writing Commands/Command Sequences To write a command or command sequence (which in- cludes programming data to the device and erasing sec- tors of memory), the system must drive WE# and CE# to VIL, and OE# to VIH. The device features an Unlock Bypass mode to facili- tate faster programming. Once the device enters the Un- lock Bypass mode, only two write cycles are required to program a word, instead of four. The “Program Com- mand Sequence” section has details on programming data to the device using both standard and Unlock By- pass command sequences. An erase operation can erase one sector, multiple sec- tors, or the entire device. Table 2 indicates the address space that each sector occupies. A “sector address” consists of the address bits required to uniquely select a sector. The “Command Definitions” section has details on erasing a sector or the entire chip, or suspending/re- suming the erase operation. After the system writes the autoselect command se- quence, the device enters the autoselect mode. The sys- tem can then read autoselect codes from the internal register (which is separate from the memory array) on DQ7–DQ0. Standard read cycle timings apply in this mode. Refer to the “Autoselect Mode” and “Reset Com- mand” sections for more information. ICC2 in the DC Characteristics table represents the ac- tive current specification for the write mode. The “AC Characteristics” section contains timing specification ta- bles and timing diagrams for write operations. Program and Erase Operation Status During an erase or program operation, the system may check the status of the operation by reading the status bits on DQ7–DQ0. Standard read cycle timings and ICC read specifications apply. Refer to “Write Operation Sta- tus” for more information, and to “AC Characteristics” for timing diagrams. Standby Mode When the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, inde- pendent of the OE# input. The device enters the CMOS standby mode when the CE# and RESET# pins are both held at VCC ± 0.3 V. (Note: This is a more restricted voltage range than VIH.) If CE# and RESET# are held at VIH, but not within VCC ± 0.3 V, the device is in the standby mode, but the standby current is greater. The device requires standard access time (tCE) for read access when the device is in either of these standby modes, before it is ready to read data. If the device is deselected during erasure or program- ming, the device draws active current until the operation is completed. In the DC Characteristics table, ICC3 and ICC4 represents the standby current specification. Automatic Sleep Mode The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables this mode when addresses remain stable for tACC + 30 ns. The automatic sleep mode is independent of the CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output data is latched and always available to the system. ICC4 in the DC Characteristics table represents the automatic sleep mode current specification. RESET#: Hardware Reset Pin The RESET# pin provides a hardware method of reset- ting the device to reading array data. When the system drives the RESET# pin to VIL for at least a period of tRP, the device immediately terminates any operation in progress, tristates all data output pins, and ignores all read/write attempts for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity. |
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