Philips Semiconductors

PCF8563

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Product specification

16 April 1999

27 of 30

9397 750 04855

© Philips Electronics N.V. 1999. All rights reserved.

14.4 Package related soldering information

[1]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal

or external package cracks may occur due to vaporization of the moisture in them (the so called

popcorn effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

[2]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

[3]

These packages are not suitable for wave soldering as a solder joint between the printed-circuit board

and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top

version).

[4]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[5]

Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger

than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[6]

Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

15. Revision history

Table 31: Suitability of IC packages for wave, reflow and dipping soldering methods

Mounting

Package

Soldering method

Wave

Reflow [1] Dipping

Through-hole

mount

DBS, DIP, HDIP, SDIP, SIL suitable [2]

−

suitable

Surface mount

BGA, SQFP

not suitable

suitable

−

HLQFP, HSQFP, HSOP,

HTSSOP, SMS

not suitable [3]

suitable

−

PLCC [4], SO, SOJ

suitable

suitable

−

LQFP, QFP, TQFP

not recommended [4] [5] suitable

−

SSOP, TSSOP, VSO

not recommended [6]

suitable

−

Rev Date

CPCN

Description

01

990416

-

This data sheet supersedes the version of 1998 Mar 25 (9397 750 03282):

new presentation and information standard