1997 Apr 02

16

Philips Semiconductors

Product specification

PCF8574

12 PACKAGE OUTLINES

UNIT

A

max.

1

2

cE

e

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

92-10-02

95-01-19

A

min.

A

max.

b

max.

w

1.40

1.14

0.055

0.045

0.53

0.38

0.32

0.23

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.254

2.54

7.62

0.30

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7

0.51

3.7

0.15

0.021

0.015

0.013

0.009

0.01

0.10

0.020

0.19

050G09

MO-001AE

c

(e )

1

A

L

e

D

Z

16

1

9

8

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1)

(1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1