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PCF8577CU/10 数据表(PDF) 20 Page - NXP Semiconductors |
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PCF8577CU/10 数据表(HTML) 20 Page - NXP Semiconductors |
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20 / 28 page  1998 Jul 30 20 Philips Semiconductors Product specification LCD direct/duplex driver with I2C-bus interface PCF8577C Table 3 Bonding pad locations (dimensions in µm) All x and y co-ordinates are referenced to the centre of the chip, see Fig.18. SIGNAL PAD POSITION CENTRED xy S32 −86 941 S31 −257 941 S30 −428 941 S29 −599 941 S28 −836 941 S27 −836 769 S26 −836 598 S25 −836 427 S24 −836 256 S23 −836 85 S22 −836 −86 S21 −836 −257 S20 −836 −428 S19 −836 −599 S18 −836 −770 S17 −836 −941 S16 −599 −941 S15 −428 −941 S14 −257 −941 S13 −86 −941 S12 85 −941 S11 256 −941 S10 427 −941 S9 598 −941 S8 836 −941 S7 836 −770 S6 836 −599 S5 836 −428 S4 836 −257 S3 836 −86 S2 836 85 S1 836 256 BP1 836 427 A2/BP2 836 598 VDD 836 769 A1 836 941 A0/OSC 598 941 VSS 427 941 SCL 256 941 SDA 85 941 Recpats C −586 −699 F −580 663 SIGNAL PAD POSITION CENTRED xy |
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