| 数据搜索系统,热门电子元器件搜索 |
|
TSL2568CS 数据表(PDF) 49 Page - OSRAM GmbH |
|
|
|||||||||||||||||||||||||||||
TSL2568CS 数据表(HTML) 49 Page - OSRAM GmbH |
|
49 / 56 page ![]() Page 48 ams Datasheet Document Feedback [v1-00] 2016-Apr-12 TSL2568, TSL2569 − Manufacturing Information Tooling Required • Chipscale • Solder stencil (square aperture size 0.210mm, stencil thickness of 152μm) • TMB • Solder stencil (aperture size 0.70mm x 0.90mm, stencil thickness of 152μm) Process 1. Apply solder paste using stencil 2. Place component 3. Reflow solder/cure 4. X-Ray verify (recommended for chipscale only) Additional Notes for Chipscale Placement of the TSL2568/TSL2569 chipscale device onto the gold immersion substrate is accomplished using a standard surface mount manufacturing process. Using a 152μm stencil with a 0.21mm square aperture, print solder paste onto the substrate. Machine-place the TSL2568/TSL2569 from the tape onto the substrate. A suggest pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has a rubber tip with a diameter of approximately 0.75mm. The part is picked up from the center of the body. It is important to use a substrate that has an immersion plating surface. This may be immersion gold, solder, or white tin. Hot air solder leveled (HASL) substrates are not coplanar, making them difficult to work with. Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package molding compound. To ensure the package molding compound contains the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. The CS package has been assigned a moisture sensitivity level of MSL 2 and the devices should be stored under the following conditions: • Temperature Range: 5°C to 50°C • Relative Humidity: 60% maximum • Floor Life: 1 year out of bag at ambient < 30°C / 60% RH |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |