TSL25713 datasheet(33/39 Pages) OSRAM

33 / 39 page

Page 32

ams Datasheet

Document Feedback

[v1-01] 2018-Mar-27

TSL2571 − Manufacturing Information

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package.

To ensure the package contains the smallest amount of

absorbed moisture possible, each device is dry-baked prior to

being packed for shipping.

Devices are packed in a sealed aluminized envelope called a

moisture barrier bag with silica gel to protect them from

ambient moisture during shipping, handling, and storage

before use.

The FN package has been assigned a moisture sensitivity level

of MSL 3 and the devices should be stored under the following

conditions:

• Temperature Range: 5°C to 50°C

• Relative Humidity: 60% maximum

• Total Time: 12 months from the date code on the

aluminized envelope—if unopened

• Opened Time: 168 hours or fewer

Rebaking will be required if the devices have been stored

unopened for more than 12 months or if the aluminized

envelope has been open for more than 168 hours. If rebaking

is required, it should be done at 50°C for 12 hours.

TSL25713 数据表(PDF) 33 Page - OSRAM GmbH