ams Datasheet

Page 41

[v1-00] 2016-Mar-22

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TSL2771 − Mechanical Data

Figure 46:

Package FN — Dual Flat No-Lead Packaging Configuration

Note(s):

1. All linear dimensions are in micrometers. Dimension tolerance is ± 20

μm unless otherwise noted.

2. The die is centered within the package within a tolerance of ±3 mils.

3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

5. This package contains no lead (Pb).

6. This drawing is subject to change without notice.

Mechanical Data

2

2

PACKAGE FN

Dual Flat No-Lead

203

+ 8

6 SDA

5 INT

4 LDR

VDD 1

SCL 2

GND 3

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Lead Free

Pb

300

+ 50

650

2000

+ 100

2000

+ 100

PIN 1

PIN 1

END VIEW

650

+ 50

PIN OUT

TOP VIEW

750

+ 150

Photodiode Array Area

295

Nominal

466

+ 10

466

+ 10

CL of Solder Contacts

CL of Photodiode Array Area

(Note B)

20 Nominal

CL of Solder Contacts

of Photodiode Array Area (Note B)

CL

140 Nominal

2

2

Green

RoHS