33742S datasheet(8/65 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33742

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Figure 5. Transient Test Setup for L0:L3 Inputs

Figure 6. Transient Test Setup for CANH/CANL

THERMAL RATINGS

Operating Temperature

Ambient

Junction

-40 to 125

-40 to 150

°C

Storage Temperature

TSTG

-55 to 165

°C

Thermal Resistance

RθJG

°C/W

Thermal Resistance Junction Case (QFN)

RTJC-RθJC

TBD

°C/W

Power Dissipation (4)

1.0

Peak Package Reflow Temperature During Reflow (6), (7)

TPPRT

Note 7

°C

Notes

Maximum power dissipation is at 85°C ambient temperature in free aIr and with no heatsink, according to JEDEC JESD51-2 and

JESD51-3 specifications.

The package is not designed for immersion soldering. The maximum soldering time is 10 seconds at 240

°C on any pin. Exceeding the

maximum temperature and time limits may cause permanent damage to the device.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

Table 4. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit

Transient Pulse

GND

Generator

1.0 nF

(Note)

10 k

Ω

Note

Waveform per ISO 7637-1. Test Pulses 1, 2, 3a, and 3b.

GND

33742

CANH

CANL

Transient Pulse

GND

Generator

1.0 nF

(Note)

Note

Waveform per ISO 7637-1. Test Pulses 1, 2, 3a, and 3b.

33742

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