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PEMD13 数据表(PDF) 3 Page - NXP Semiconductors |
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PEMD13 数据表(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 2001 Sep 11 3 Philips Semiconductors Preliminary specification NPN/PNP resistor-equipped transistors; R1 = 4.7 k Ω, R2=47kΩ PEMD13 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). Note 1. Transistor mounted on an FR4 printed-circuit board. THERMAL CHARACTERISTICS Notes 1. Transistor mounted on an FR4 printed-circuit board. 2. The only recommended soldering method is reflow soldering. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per transistor; for the PNP transistor with negative polarity VCBO collector-base voltage open emitter − 50 V VCEO collector-emitter voltage open base − 50 V VEBO emitter-base voltage open collector − 10 V VI input voltage TR1 positive − +30 V negative −−5V input voltage TR2 positive − +5 V negative −−30 V IO output current (DC) − 100 mA ICM peak collector current − 100 mA Ptot total power dissipation Tamb ≤ 25 °C; note 1 − 200 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C Per device Ptot total power dissipation Tamb ≤ 25 °C; note 1 − 300 mW SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-a thermal resistance from junction to ambient notes 1 and 2 416 K/W |
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