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SE2425U-R 数据表(PDF) 1 Page - SiGe Semiconductor, Inc.

部件名 SE2425U-R
功能描述  RangeChargerTM 2.4 GHz Bluetooth Power Amplifier IC Preliminary Information
PDF  10 Pages
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制造商  SIGE [SiGe Semiconductor, Inc.]
网页  http://www.sige.com
标志 SIGE - SiGe Semiconductor, Inc.

SE2425U-R 数据表(HTML) 1 Page - SiGe Semiconductor, Inc.

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SE2425U
RangeCharger
TM 2.4 GHz Bluetooth Power Amplifier IC
Preliminary Information
165-DST-01 Rev 1.3 Apr-05-2006
Confidential
1 of 10
QA040506
Applications
Bluetooth
tm wireless technology (Class 1)
USB dongles, PCMCIA, flash cards, Access Points
Enhanced data rate
Features
Integrated input and inter-stage match
+25 dBm GFSK Output Power
+19.5 dBm 8DPSK Output Power
Low current: 110 mA typical @ POUT = +20 dBm
Ultra low quiescent current: 28 mA
Digital Enable for direct interface to standard
CMOS processors
Mode-control for easy switching between standard
and EDR modes
Gain: 29 dB
3.3 V single supply operation
Ordering Information
Type
Package
Remark
SE2425U
3 x 3 x 0.5 mm QFN
Sample
SE2425U-R
3 x 3 x 0.5 mm QFN
Tape & Reel
SE2425U-EK1
N/A
Evaluation Kit
Product Description
A monolithic, high-efficiency, silicon-germanium power
amplifier IC, the SE2425U is designed for 2.4 GHz
wireless applications, including Bluetooth
TM Class 1
basic rate and enhanced data rate applications. It
delivers +25 dBm output power in standard rate GFSK
mode and +19.5 dBm output power in enhanced rate
8DPSK.
The SE2425U provides a digital mode control input for
boosting the linear performance for enhanced data rate
applications.
The SE2425U operates at 3.3 V DC with a peak
efficiency of 43 % in basic rate and 21 % in enhanced
rate mode. The internal bias management allows the
part to only draw 28 mA in Class 2 output power levels.
Output match integrates the high Q inductors to reduce
component count and bill of materials. It uses two
external capacitors to allow for varying loads, such as
switches and filters, in different applications.
The
silicon/silicon-germanium
structure
of
the
SE2425U, and its exposed die-pad package, soldered
to the system PCB, provide high thermal conductivity
and a subsequently low junction temperature. This
device is capable of operating at a duty cycle of 100
percent.
Functional Block Diagram
Input
Match
Inter-
Stage
Match
EN
( 4 )
MODE
( 5 )
VCC0
( 2 )
RF IN
( 1 )
RF OUT
( 7 )
GND
( Paddle )
Inter-
Stage
Match
Digital Bias & Enable Logic
VCC2
( 15 )
VCC1
( 16 )
VCC3
( 14 )
SiGe SE2425U
Figure 1: SE2425U Block Diagram


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