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SN74LVC10APWR 数据表(PDF) 3 Page - Texas Instruments |
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SN74LVC10APWR 数据表(HTML) 3 Page - Texas Instruments |
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3 / 30 page ![]() 3 Pin Configuration and Functions 1 1A 14 VCC 2 1B 13 1C 3 2A 12 1Y 4 2B 11 3C 5 2C 10 3B 6 2Y 9 3A 7 GND 8 3Y Not to scale Figure 3-1. SN74LVC10A D, DB, NS, or PW Packages; 14-Pin SOIC, SSOP, SOP, or TSSOP (Top View) Thermal Pad 2 1B 3 2A 4 2B 5 2C 6 2Y 9 3A 10 3B 11 3C 12 1Y 13 1C Not to scale Figure 3-2. SN74LVC10A BQA Package, 14-Pin WQFN (Top View) Table 3-1. Pin Functions PIN I/O(1) DESCRIPTION NAME NO. 1A 1 Input Channel 1, Input A 1B 2 Input Channel 1, Input B 2A 3 Input Channel 2, Input A 2B 4 Input Channel 2, Input B 2C 5 Input Channel 2, Input C 2Y 6 Output Channel 2, Output Y GND 7 — Ground 3Y 8 Output Channel 3, Output Y 3A 9 Input Channel 3, Input A 3B 10 Input Channel 3, Input B 3C 11 Input Channel 3, Input C 1Y 12 Output Channel 1, Output Y 1C 13 Input Channel 1, Input C VCC 14 — Positive Supply Thermal pad — Connect the GND pin to the exposed thermal pad for correct operation. Connect the thermal pad to any internal PCB ground plane using multiple vias for good thermal performance. (1) I = input, O = output, P = power, FB = feedback, GND = ground, N/A = not applicable www.ti.com SN74LVC10A SCAS284P – JANUARY 1993 – REVISED MAY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: SN74LVC10A |
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