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SN74LVC10APWR 数据表(PDF) 9 Page - Texas Instruments |
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SN74LVC10APWR 数据表(HTML) 9 Page - Texas Instruments |
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9 / 30 page ![]() 7 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 7.1 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating in the Recommended Operating Conditions. Each VCC pin must have a good bypass capacitor to prevent power disturbance. For devices with a single supply, 0.1 µF is recommended; if there are multiple VCC pins, then 0.01 µF or 0.022 µF is recommended for each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 µF and a 1 µF are commonly used in parallel. The bypass capacitor must be installed as close to the power pin as possible for best results. 7.2 Layout 7.2.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. 7.2.2 Layout Example 1 2 3 4 5 6 7 14 13 12 11 10 9 8 1A 1B 2B 2C 2Y GND V CC 1C 1Y 3B 3A 3Y GND V CC 3C 2A 0.1 F Unused inputs tied to VCC Bypass capacitor placed close to the device Avoid 90° corners for signal lines Recommend GND flood fill for improved signal isolation, noise reduction, and thermal dissipation Unused output left floating Figure 7-1. Example layout for the SN74LVC10A www.ti.com SN74LVC10A SCAS284P – JANUARY 1993 – REVISED MAY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: SN74LVC10A |
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