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PVB42004X 数据表(PDF) 4 Page - NXP Semiconductors |
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PVB42004X 数据表(HTML) 4 Page - NXP Semiconductors |
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4 / 8 page ![]() 1997 Feb 19 4 Philips Semiconductors Product specification NPN microwave power transistor PVB42004X THERMAL CHARACTERISTICS Note 1. See “ Mounting recommendations in the General part of handbook SC15”. CHARACTERISTICS Tmb =25 °C unless otherwise specified SYMBOL PARAMETER CONDITIONS MAX. UNIT Rth j-mb thermal resistance from junction to mounting base Tj =75 °C 6.5 K/W Rth mb-h thermal resistance from mounting-base to heatsink Tj =75 °C; note 1 0.7 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)CES collector-emitter breakdown voltage IC = 30 mA; RBE =0 40 −− V ICBO collector cut-off current VCB = 24 V; IE =0 −− 50 mA IEBO emitter cut-off current VEB = 1.5 V; IC =0 −− 1.5 mA Ccb collector-base capacitance VCB = 24 V; VEB = 1.5 V; IE =IC = 0; f = 1 MHz − 50 − pF Cce collector-emitter capacitance VCB = 24 V; VEB = 1.5 V; IE =IC = 0; f = 1 MHz − 1.2 − pF Ceb emitter-base capacitance VCB = 24 V; VEB =1V; IE =IC = 0; f = 1 MHz − 30 − pF Fig.3 Load power as a function of frequency. VCC = 24 V; PS =1W. handbook, halfpage 12 3 5 16 12 4 0 f (GHz) PL (W) 8 4 MGD978 Fig.4 Power gain and efficiency as functions of frequency. VCC = 24 V; PS =1W. handbook, halfpage 1 ηC f (GHz) 23 5 16 12 4 0 ηC (%) Gp (dB) 8 80 60 20 0 40 4 MGD979 Gp |
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