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MPC8541ECVTAPF 数据表(PDF) 67 Page - Freescale Semiconductor, Inc |
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MPC8541ECVTAPF 数据表(HTML) 67 Page - Freescale Semiconductor, Inc |
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67 / 84 page ![]() MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 67 Thermal Figure 41. Package Exploded Cross-Sectional View with Several Heat Sink Options The system board designer can choose between several types of heat sinks to place on the MPC8541E. There are several commercially-available heat sinks from the following vendors: Aavid Thermalloy 603-224-9988 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 408-749-7601 473 Sapena Ct. #15 Santa Clara, CA 95054 Internet: www.alphanovatech.com International Electronic Research Corporation (IERC) 818-842-7277 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Millennium Electronics (MEI) 408-436-8770 Loroco Sites 671 East Brokaw Road San Jose, CA 95112 Internet: www.mei-millennium.com Tyco Electronics 800-522-6752 Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.chipcoolers.com Wakefield Engineering 603-635-5102 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com Heat Sink FC-PBGA Package Heat Sink Clip Printed-Circuit Board Die Lid Thermal Interface Material |
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