MPC8555VTALF datasheet(55/88 Pages) FREESCALE

部件名	MPC8555VTALF

功能描述	PowerQUICC??III Integrated Communications Processor Hardware Specifications

PDF	88 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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55 / 88 page

MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Package and Pin Listings

Figure 39 shows the PCI input AC timing conditions.

Figure 39. PCI Input AC Timing Measurement Conditions

Figure 40 shows the PCI output AC timing conditions.

Figure 40. PCI Output AC Timing Measurement Condition

14 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions.

14.1

Package Parameters for the MPC8555E FC-PBGA

The package parameters are as provided in the following list. The package type is 29 mm

× 29 mm, 783

flip chip plastic ball grid array (FC-PBGA).

Die size

8.7 mm

× 9.3 mm × 0.75 mm

Package outline

29 mm

× 29 mm

Interconnects

783

Pitch

1 mm

Minimum module height 3.07 mm

Maximum module height 3.75 mm

Solder Balls

62 Sn/36 Pb/2 Ag

Ball diameter (typical)

0.5 mm

tPCIVKH

CLK

Input

tPCIXKH

CLK

Output Delay

tPCKHOV

High-Impedance

tPCKHOZ

Output

MPC8555VTALF 数据表(PDF) 55 Page - Freescale Semiconductor, Inc

MPC8555VTALF 数据表(HTML) 55 Page - Freescale Semiconductor, Inc

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